Ultrafast optical switching in doped semis; PIM simulation; foundry-compatible silicon photonics MEMS switching; GPU-accelerated switching-power analysis; neuromorphic computing; magneto-ionic HW security; bond front velocity; measuring heat movement. The post Chip Industry Technical Paper Roundup: Aug. 10 appeared first on Semiconductor Engineering .
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*Source: [SemiconductorEngineering](https://semiengineering.com/chip-industry-technical-paper-roundup-aug-11/)*